1. 2. 3. material content data sheet sales product name ipp17n25s3-100 issued 29. august 2013 ma# MA001035854 package pg-to220-3-1 weight* 2035.97 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.114 0.20 0.20 2020 2020 leadframe non noble metal iron 7439-89-6 0.816 0.04 401 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 40.06 40.11 400464 400986 wire non noble metal aluminium 7429-90-5 5.587 0.27 0.27 2744 2744 encapsulation organic material carbon black 1333-86-4 8.913 0.44 4378 plastics epoxy resin - 98.041 4.82 48154 inorganic material silicondioxide 60676-86-0 487.235 23.93 29.19 239313 291845 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10542 10542 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder noble metal silver 7440-22-4 0.094 0.00 46 non noble metal tin 7440-31-5 0.075 0.00 37 non noble metal lead 7439-92-1 3.577 0.18 0.18 1757 1840 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal iron 7439-89-6 0.590 0.03 290 non noble metal copper 7440-50-8 589.466 28.95 28.99 289526 289903 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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